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BAKU BK-5051 BGA Solder Paste for Mobile Phone Repair 50g Tin 25-45 Microns 63Sn/37Pb Size_LADY N USA 7 MENS R USA 9 Loading Container 20GP: 177 cartons

SKU: 14607961804

4.8
USD16.12 USD49.12

Pay in 4 interest-free payments of $4.03 Learn more

Shipping Estimate
USA
  • USA
  • CAN

Ships within 48 hours · Estimated delivery Jul 31 - Aug 5

Description

Loading Container 20GP: 177 cartons * 30 pcs = 5310 pcs

Skin-Like Effect

Ideal for winter and cold sleepers

00 — Class A broadband absorption

Please check the measurement chart carefully before you buy the item

BAKU BK-5051 BGA Solder Paste for Mobile Phone Repair 50g Tin 25-45 Microns 63Sn/37Pb Size_LADY N USA 7 MENS R USA 9 Loading Container 20GP: 177 cartons1. Crafted with high quality 63% tin and 37% lead alloy, this solder paste delivers excellent thermal conductivity and stable melting performance, ensuring durable and reliable solder joints for BGA and SMT applications. 2. Made with halide free materials and no harmful additives, this solder paste complies with environmental safety standards. Safe for operators and ideal for electronics repair without corrosion risks. 3. No Clean, Low Residue

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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